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# Flex: Design, Manufacturing, and Supply Chain Logistics

## Sitemaps
[XML Sitemap](https://flex.com/sitemap_index.xml): Includes all crawlable and indexable pages.

## Pages
- [COMPAMED 2026](https://flex.com/compamed-2026): International trade fair for the medical technology supply industry
- [2026 Equip Exposition](https://flex.com/2026-equip-exposition): International landscape, outdoor living, and equipment exposition
- [Infrastructure Forward](https://flex.com/industries/data-center/infrastructure-forward): Infrastructure Forward is a video series exploring the technologies, systems, and industry shifts shaping the future of AI infrastructure. Through conversations with industry leaders, we examine the challenges, breakthroughs, and innovations defining what comes next.
- [Axiom and Flex Leadership](https://flex.com/company/axiom-flex-leadership): Unless otherwise noted, these appointments are expected to become effective upon completion of the planned spin-off. Last updated September 15, 2026.
- [e2open Training Materials](https://flex.com/solutions-and-services/supply-chain/supplier-information/e2open-training-materials): Flex is transitioning from the Flex Supplier Portal (FSP) and Email PO (ePO) to e2open to support supplier collaboration across purchase orders, shipments (ASN), and forecast processes.
- [Transaction Resources](https://flex.com/transaction-resources): On May 5, 2026, Flex announced plans to spin off its Cloud and Power Infrastructure business into a separate, publicly traded company. On September 15, 2026, the company unveiled Axiom Solutions International, Inc. (Axiom) as the future company’s name and filed a preliminary Form 10 registration statement with the SEC. Upon completion of the separation, Axiom is expected to trade on Nasdaq under the ticker symbol AXM.
- [Product Discontinuation Notices](https://flex.com/products/power-modules/product-discontinuation-notices): PUx and PNB-A — 06/26/2026
- [Apprenticeships at Flex in Hägglingen, Switzerland](https://flex.com/careers/switzerland/apprenticeships): At Flex, we offer our customers a comprehensive range of services across our two Swiss locations in Hägglingen and Küssnacht, covering innovation, design, engineering, manufacturing, and supply chain solutions for precision plastics production. Become part of our successful team and start your apprenticeship at Flex in Hägglingen.
- [Contact Public Relations](https://flex.com/newsroom/contact-public-relations): Contact Flex Public Relations
- [Technical Abbreviations](https://flex.com/products/power-modules/technical-abbreviations): This glossary provides definitions for key terms used in power electronics, DC/DC conversion, data center power architectures, AI compute systems, and digital power management. It supports engineers, system architects, and developers working with advanced power delivery solutions, including 48 VDC and 800 VDC architectures, OCP standards, and high-efficiency board solutions.
- [Next-gen 800 VDC architecture modules](https://flex.com/products/power-modules/800-vdc-modules): As AI, ML, and hyperscale compute workloads surge toward megawatt‑class rack power, the global data center ecosystem is undergoing its most significant architecture shift in a decade. Flex Power Modules delivers advanced in-rack power conversion and distribution solutions for both NVIDIA’s 800 VDC architecture and the Open Compute Project’s (OCP) ±400 VDC “Diablo 400” standard — the two frameworks enabling the future of efficient, scalable, and sustainable AI infrastructure.
- [Download Flex Power designer](https://flex.com/products/power-modules/flex-power-designer/download-software): Download Flex Power Designer To download our free software, please submit the details requested below:
- [Flex Automotive — EMC Laboratory Stuttgart ISO 17025:2018 accredited](https://flex.com/industries/automotive/flex-automotive-emc-laboratory-stuttgart-iso-170252018-accredited): The EMC Lab in Frickenhausen is part of Flex Automotive organization in Germany, dedicated to testing automotive products and is accredited according to the international ISO 17025:2018 Standard. The accreditation is provided by DAkkS and proves that the laboratory uses official and standardized test methods, regularly calibrated equipment, and provides reproducible and independent test results.
- [FAQs](https://flex.com/products/power-modules/faqs): Find answers to the most frequently asked questions from our world-wide customers and partners
- [Thermal management and cooling techniques](https://flex.com/products/power-modules/thermal-management-and-cooling-techniques): Thermal design for DC/DC converters is a critical aspect of ensuring the reliability and longevity of power electronics systems. DC/DC converters generate heat due to switching and conduction power losses in the components (such as semiconductors, inductors, and capacitors) during the power conversion process.
- [Vertical Power Delivery](https://flex.com/products/power-modules/vertical-power-delivery): Power hungry applications such as Artificial Intelligence (AI) and Machine Learning (ML) which utilize the latest ASICs or xPUs (TPU/GPU/CPU/NPU/IPU) require vast amounts of current to be delivered to the core at sub 1 V levels, and need to deal with ultra fast load transient demands with the least amount of disturbance to the critical voltages used to feed them.
- [Power Modules Contact Us](https://flex.com/products/power-modules/contact-us): Contact Flex Power Modules Use the form below to send general or technical inquiries to our support team.
- [Flex Power Designer](https://flex.com/products/power-modules/flex-power-designer): The Flex Power Designer software goes beyond converter configuration and provides an overview of the whole power system enabling you to define relationships across rails, including phase spreading, sequencing, and fault spreading, using the standard PMBus protocol.
- [Power Modules](https://flex.com/products/power-modules): Flex Power Modules is a global leader in advanced power conversion solutions. For over 45 years, we’ve delivered high-efficiency DC/DC converters that enable the performance and reliability demanded by today’s most critical applications—data centers, cloud computing, AI, telecom, industrial automation, and railway systems.
- [Product Selector](https://flex.com/products/power-modules/product-selector)
- [Accessibility](https://flex.com/accessibility): Flex.com is designed and developed to be accessible to the widest possible audience, including people with disabilities, and to be compatible with commonly used assistive technologies and accessibility features provided by major operating systems and web browsers.
- [Komplex kutatás-fejlesztési program megvalósítása a Flextronics International Kft. zalaegerszegi telephelyén](https://flex.com/careers/hungary/komplex-kutatas-fejlesztesi-program-megvalositasa-a-flextronics-international-kft-zalaegerszegi-telephelyen): A kedvezményezett neve: Flextronics International Termelő és Szolgáltató Vámszabadterületi Kft.
- [Social @ Flex](https://flex.com/social-flex): Social @ Flex
- [Awards](https://flex.com/company/awards): Flex Awards
- [Flex Automotive Product Security Incident Response Management (PSIRM)](https://flex.com/flex-automotive-product-security-incident-response-management-psirm): At Flex, we prioritize the security, safety, and reliability of our products above all.
- [Power and Cooling](https://flex.com/products/power-and-cooling): Our products and services from Anord Mardix, Crown Technical Systems, and Electrical Power Products (EP²) deliver safe, reliable, and high-quality critical power solutions. We deliver innovative solutions, effortlessly meeting even the most complex technical requirements.
- [Products](https://flex.com/products): Products
- [A Magyar Nemzeti Kutatási, Fejlesztési és Innovációs Alap által támogatott K+F](https://flex.com/careers/hungary-en/a-magyar-nemzeti-kutatasi-fejlesztesi-es-innovacios-alap-altal-tamogatott-kf): A Pannon Egyetem együttműködött a Flex vállalatával egy kormányzati támogatású, kutatási projektben azzal a céllal, hogy javítsák a forrasztási technológia hatékonyságát és megbízhatóságát, különösen az autóiparban alkalmazott, teljesítmény szempontjából kritikus elektronikai szerelvényeknél. A „Folyasztószer-minimalizált forrasztás nagyfeszültségű autóipari termékekhez” című projektet közösen finanszírozta a Flex Kft, a Pannon Egyetem és az Innovációs és Technológiai Minisztérium (ITM), amelynek összköltsége 1.339.723.068 Ft. Sikerült egy olyan új típusú, forrasztási technológiát kifejleszteni, amivel megnövelhető a hibrid és az autonóm járművekben alkalmazott nagyfeszültségű, autóelektronikai szerelvények élettartama és megbízhatósága, a panelen visszamaradó ionos szennyeződések mennyiségének csökkentésével.

## Downloads
- [2026 Irish Express Cargo Gender Pay Gap Report](https://flex.com/downloads/2026-irish-express-cargo-gender-pay-gap-report)
- [Axiom AI Modules brochure](https://flex.com/downloads/axiom-ai-modules-brochure)
- [800 VDC White Paper: Accelerating the transition to next-generation data center power architectures](https://flex.com/downloads/800-vdc-white-paper-accelerating-the-transition-to-next-generation-data-center-power-architectures)
- [Built different: The rise of data center productization [Infographic]](https://flex.com/downloads/built-different-the-rise-of-data-center-productization-infographic)
- [System-level modular infrastructure reference design for NVIDIA Vera Rubin NVL72](https://flex.com/downloads/system-level-modular-infrastructure-reference-design-for-nvidia-vera-rubin-nvl72)
- [Data Center IT Rack: OCP ORV3 IT cabinet](https://flex.com/downloads/data-center-it-rack-ocp-orv3-it-cabinet)
- [Data Center IT Rack: OCP ORV3 HPR IT Cabinet](https://flex.com/downloads/data-center-it-rack-ocp-orv3-hpr-it-cabinet)
- [Flex Secure Control Module brochure: (DC-SCM2) SCM203A](https://flex.com/downloads/flex-secure-control-module-brochure-dc-scm2-scm203a)
- [JetCool Direct-to-Chip Liquid Cooling Solutions](https://flex.com/downloads/jetcool-direct-to-chip-liquid-cooling-solutions)
- [Power Shelf for NVIDIA GB300 NVL72 (33kW) Datasheet](https://flex.com/downloads/power-shelf-for-nvidia-gb300-nvl72-33kw-datasheet)
- [Axiom 800 VDC Power Rack brochure](https://flex.com/downloads/axiom-800-vdc-power-rack-brochure)
- [Brochure: Prefabricated modular power solutions (NAM)](https://flex.com/downloads/brochure-prefabricated-modular-power-solutions-nam)
- [Brochure: Prefabricated modular power solutions (EMEA)](https://flex.com/downloads/brochure-prefabricated-modular-power-solutions-emea)
- [Integrated control systems brochure from Electrical Power Products](https://flex.com/downloads/integrated-control-systems-brochure-from-electrical-power-products)
- [Product brief: Flex Secure Control Module DC SCM 2.2 SCM203A](https://flex.com/downloads/product-brief-scm203a)
- [Brazil Pay Gap Report 2026 (Second Semester)](https://flex.com/downloads/brazil-pay-gap-report-2026-second-semester)
- [Brazil pay gap – 24](https://flex.com/downloads/brazil-pay-gap-24)
- [Brazil pay gap – 85](https://flex.com/downloads/brazil-pay-gap-85)
- [Brazil pay gap – 28](https://flex.com/downloads/brazil-pay-gap-28)
- [Brazil pay gap – 03](https://flex.com/downloads/brazil-pay-gap-03)
- [Brazil pay gap – 09](https://flex.com/downloads/brazil-pay-gap-09)
- [Brazil pay gap – 10](https://flex.com/downloads/brazil-pay-gap-10)
- [Power distribution centers (PDCs) Solution Brief](https://flex.com/downloads/power-distribution-centers-pdcs-solution-brief)
- [BMR351 (40-60Vin, 12.20Vout, 1600-2320W, ACS)](https://flex.com/downloads/bmr351-40-60vin-12-20vout-1600-2320w-acs)
- [Smart Home Brochure](https://flex.com/downloads/smart-home-brochure)
- [Thermal Model BMR353](https://flex.com/downloads/thermal-model-bmr353)
- [Solution Brief: Medium voltage (MV) switchgear and control E‑house](https://flex.com/downloads/solution-brief-medium-voltage-mv-switchgear-and-control-e-house)
- [Healthcare Prototyping Solution Brief](https://flex.com/downloads/healthcare-prototyping-solution-brief)
- [A full-frequency MIMO smallsignal model for average current-mode control](https://flex.com/downloads/a-full-frequency-mimo-smallsignal-model-for-average-current-mode-control)
- [Project Closure Announcement – Flex-Minimized Soldering for High-Voltage Automotive Products](https://flex.com/downloads/project-closure-announcement)
- [Supplier Sustainability Regulations Deck](https://flex.com/downloads/supplier-sustainability-regulations-deck)
- [Product Discontinuation Notice – PKJ7210 variants 11/24/2025](https://flex.com/downloads/product-discontinuation-notice-pkj7210-variants-11-24-2025)
- [Simplified STEP file – BMR353 (typ)](https://flex.com/downloads/simplified-step-file-bmr353-typ)
- [GHG Program – Kick off 2026 CH](https://flex.com/downloads/ghg-program-kick-off-2026-ch)
- [GHG Program – Kick off 2026 ENG](https://flex.com/downloads/ghg-program-kick-off-2026-eng)
- [BMR353xx00/001 (40-60Vin, 12.2Vout, 860-1200W)](https://flex.com/downloads/bmr353xx00-001-40-60vin-12-2vout)
- [Product Discontinuation Notice – PKR2221A variants 06/25/2026](https://flex.com/downloads/product-discontinuation-notice-pkr2221a-variants-06-25-2026)
- [Product Discontinuation Notice – PUx_PNB-A modules 06/26/2026](https://flex.com/downloads/product-discontinuation-notice-pux_pnb-a-modules-06-26-2026)
- [Product Discontinuation Notice – BMR480 06/25/2026](https://flex.com/downloads/product-discontinuation-notice-bmr480-06-25-2026)
- [E2open 供应协作 用户指南 针对供应商角色 – 标准用户界面](https://flex.com/downloads/e2open-%e4%be%9b%e5%ba%94%e5%8d%8f%e4%bd%9c-%e7%94%a8%e6%88%b7%e6%8c%87%e5%8d%97-%e9%92%88%e5%af%b9%e4%be%9b%e5%ba%94%e5%95%86%e8%a7%92%e8%89%b2-%e6%a0%87%e5%87%86%e7%94%a8%e6%88%b7%e7%95%8c)
- [E2open 供应协作 用户指南 针对供应商角色 – 长尾合作伙伴](https://flex.com/downloads/e2open-%e4%be%9b%e5%ba%94%e5%8d%8f%e4%bd%9c-%e7%94%a8%e6%88%b7%e6%8c%87%e5%8d%97-%e9%92%88%e5%af%b9%e4%be%9b%e5%ba%94%e5%95%86%e8%a7%92%e8%89%b2-%e9%95%bf%e5%b0%be%e5%90%88%e4%bd%9c%e4%bc%99)
- [2025 CDP Climate Change and Water Security Questionnaire](https://flex.com/downloads/2025-cdp-climate-change-and-water-security-questionnaire)
- [Beyond PUE Infographic: Data center efficiency in the AI era](https://flex.com/downloads/beyond-pue-infographic-data-center-efficiency-in-the-ai-era)
- [Case Study: Flex pilots Catena-X-based data exchange for global automakers](https://flex.com/downloads/case-study-flex-pilots-catena-x-based-data-exchange-for-global-automakers)
- [Power shelf for NVIDIA Vera Rubin NVL72 Datasheet](https://flex.com/downloads/power-shelf-for-nvidia-vera-rubin-nvl72-datasheet)
- [用户界面概述](https://flex.com/downloads/%e7%94%a8%e6%88%b7%e7%95%8c%e9%9d%a2%e6%a6%82%e8%bf%b0)

## News

## Resources
- [Flex completes acquisition of EPC Power](https://flex.com/resources/flex-completes-acquisition-of-epc-power): The acquisition adds leading power conversion capabilities for AI data centers and grid applications.
- [Accelerate AI factory deployment with Axiom AI Modules](https://flex.com/resources/accelerate-ai-factory-deployment-with-axiom-ai-modules): Integrate critical AI infrastructure into pre-engineered, factory-built systems with Axiom AI Modules.
- [System-level modular infrastructure reference design for NVIDIA Vera Rubin NVL72](https://flex.com/resources/system-level-modular-infrastructure-reference-design-for-nvidia-vera-rubin-nvl72): This reference design defines a factory-integrated modular AI data hall
organized into repeatable deployment blocks.
- [800 VDC data center power: Accelerate adoption with lessons from EV automakers](https://flex.com/resources/800-vdc-data-center-power-accelerate-adoption-with-lessons-from-ev-automakers): EV manufacturers spent more than a decade refining the technologies, safety mechanisms, and operational practices required to manage 800 VDC systems. These advances include insulation monitoring, interlock loops, fast fault protection, thermal management strategies, reinforced isolation techniques, and battery safety systems. Many of these technologies and lessons learned can accelerate the deployment of next-generation data center architectures while reducing technical risk and improving operational safety. Explore which lessons transfer to data centers and where the demands of continuous operation call for a different approach in this white paper by Flex and UL Solutions.
- [Intern for a day at Flex in Timisoara](https://flex.com/resources/intern-for-a-day-at-flex-in-timisoara): What happens when you swap leadership for internship?
- [Built different: The rise of data center productization for AI-ready infrastructure](https://flex.com/resources/built-different-the-rise-of-data-center-productization-for-ai-ready-infrastructure): Learn about the evolution from singular construction projects to repeatable, AI-ready infrastructure.
- [The vertically integrated E-house ](https://flex.com/resources/the-vertically-integrated-e-house): Learn how a vertically integrated E-house connects engineering, supply chain, and manufacturing for faster deployment.
- [Cooling custom silicon at scale](https://flex.com/resources/cooling-custom-silicon-at-scale): Custom silicon is gaining ground quickly. Counterpoint Research expects AI server compute ASIC shipments among the top 10 players to triple between 2024 and 2027, driven by Google TPU infrastructure, AWS Trainium clusters, and growing deployments of Meta MTIA and Microsoft Maia. TrendForce likewise reports increasing cloud service provider (CSP) investment in ASICs to improve workload suitability and data center cost efficiency.
- [Automation starts with manufacturing outcomes, not robots](https://flex.com/resources/automation-starts-with-manufacturing-outcomes-not-robots): High‑precision, automated processes are enabling manufacturers to achieve superior quality at scale, lowering defect rates while protecting brand and margin, making automation a strategic priority for manufacturers worldwide. Deloitte’s 2025 Smart Manufacturing Survey found that nearly half of manufacturing executives ranked process automation as their first or second investment priority over the next two years, reflecting a broader shift toward automation as a long-term operational capability rather than a collection of isolated capital projects. As automation spending grows, manufacturers are raising the bar for investment decisions.
- [From black box to ecosystem: Engineering the unbundled vehicle](https://flex.com/resources/from-black-box-to-ecosystem-engineering-the-unbundled-vehicle): See how software-defined vehicle manufacturing connects engineering, industrialization, sourcing, testing, and production at scale.
- [From innovation to industrialization: What it takes to manufacture robots at scale](https://flex.com/resources/from-innovation-to-industrialization-what-it-takes-to-manufacture-robots-at-scale): Flex delivers commercial success by optimizing robotics design for manufacturing and long-term viability.
- [Matching IBC architectures to AI data center load profiles](https://flex.com/resources/matching-ibc-architectures-to-ai-data-center-load-profiles): Matching the right IBC architecture to AI data center load profiles can be a huge challenge. Find the right solution.
- [Power distribution centers (PDCs)](https://flex.com/resources/power-distribution-centers-pdcs): All-in-one, drop-in-place power distribution centers (PDCs) powering utilities, data centers, transportation, and industrial applications.
- [Matching robot form factors to manufacturing outcomes](https://flex.com/resources/matching-robot-form-factors-to-manufacturing-outcomes): Understanding the strengths and applicability of each robot form factor enables OEMs to advise customers on best-fit technologies.
- [IVD manufacturing: How Flex solved a complex material change management challenge](https://flex.com/resources/ivd-manufacturing-how-flex-solved-a-complex-material-change-management-challenge): Learn how Flex's IVD manufacturing expertise helped navigate a critical material change and avoid production disruptions.
- [Flex announces Amy B. Schwetz as expected Flex CFO](https://flex.com/resources/flex-announces-amy-b-schwetz-as-expected-flex-cfo): Amy B. Schwetz will join Flex as CFO of its RMS and ITS segments, bringing more than 25 years of experience.
- [Empowering outdoor equipment brands to build what’s next](https://flex.com/resources/empowering-outdoor-equipment-brands-to-build-whats-next): See how Flex helps brands innovate, build, and scale their next generation of outdoor equipment products with confidence.
- [Flex to Acquire EPC Power, Adding Leading Power Conversion Capabilities for AI Data Centers and Grid Applications](https://flex.com/resources/flex-to-acquire-epc-power-adding-leading-power-conversion-capabilities-for-ai-data-centers-and-grid-applications): The proposed acquisition would add leading power conversion capabilities for AI data centers and grid applications.
- [Scaling AI starts with repeatable infrastructure](https://flex.com/resources/scaling-ai-starts-with-repeatable-infrastructure): Utilizing standardized, modularized products requires faster deployment models with repeatable infrastructure.
- [From concept to commercialization: Flex and HistoSonics earn three top IDEA Awards for innovative liver tumor treatment system](https://flex.com/resources/flex-and-histosonics-earn-idea-awards-for-innovative-liver-tumor-treatment-system): Flex and HistoSonics received 3 IDEA Awards for their collaboration on the Edison System, a non-invasive liver tumor destruction platform.
- [Lessons in supply chain resilience](https://flex.com/resources/lessons-in-supply-chain-resilience): Discover lessons Flex has learned to help organizations build supply chain resilience and what that means for the future.
- [Enabling secure, smart home devices designed for the modern home](https://flex.com/resources/enabling-secure-smart-home-devices-designed-for-the-modern-home)
- [Flex to join Bloomberg 500 (B500) Index](https://flex.com/resources/flex-to-join-bloomberg-500-b500-index): Flex has been selected for inclusion in the B500 Index, which tracks 500 of the most highly capitalized U.S. companies.
- [800 VDC: Building the power architecture for next-generation AI infrastructure at scale](https://flex.com/resources/800-vdc-building-the-power-architecture-for-next-generation-ai-infrastructure-at-scale): Discover how moving to 800 VDC power architecture can support higher-density, more efficient AI data centers.
- [Power: The new currency of the world ](https://flex.com/resources/power-the-new-currency-of-the-world): AI data center power architecture is evolving to support 800 VDC and ±400 VDC power distribution and advanced power delivery.
- [Medium voltage (MV) switchgear and control E‑house](https://flex.com/resources/medium-voltage-mv-switchgear-and-control-e-house): Discover how prefabricated medium voltage switchgear and control E-houses accelerate deployment and improve scalability.
- [Regulatory resilience is the next supply chain imperative](https://flex.com/resources/regulatory-resilience-is-the-next-supply-chain-imperative): The FCC’s recent actions on several foreign-produced connected infrastructure and autonomous systems highlight a broader reality: Regulatory change, cybersecurity, and supply chain strategy are increasingly interconnected 
- [Advanced prototyping for medical technology and pharmaceutical companies](https://flex.com/resources/advanced-prototyping-for-medical-technology-and-pharmaceutical-companies): Accelerate product innovation with advanced prototyping tools and methodologies from Flex.
- [How grid-aware efficiency (GAE) can guide data center architecture decisions](https://flex.com/resources/how-grid-aware-efficiency-gae-can-guide-data-center-architecture-decisions): Learn how GAE is driving conversations about the role data centers play in the broader energy ecosystem.
- [Infrastructure Forward](https://flex.com/resources/infrastructure-forward): Watch our video series exploring the technologies, systems, and industry shifts shaping the future of AI infrastructure.
- [Rethinking 5 assumptions about data center power](https://flex.com/resources/rethinking-5-assumptions-about-data-center-power): As AI workloads increase and data centers expand, several assumptions about data center power deserve another look.
- [A full-frequency MIMO small-signal model for average current-mode control](https://flex.com/resources/a-full-frequency-mimo-small-signal-model-for-average-current-mode-control): Many existing models can miss important high-frequency effects or become too cumbersome for practical control design.
- [Powering Europe’s AI expansion with modular power infrastructure solutions](https://flex.com/resources/powering-europes-ai-expansion-with-modular-power-infrastructure-solutions): Learn how Flex’s Bielsko-Biala, Poland, site is addressing critical AI infrastructure challenges.
- [Edna Liliana Hernández, Master Scheduler](https://flex.com/resources/edna-liliana-hernandez-master-scheduler): Through dedication, resilience, and continuous growth, Edna Liliana Hernández has built a career driven by pride in her work and commitment to excellence.
- [25 years growing at Flex in Mexico](https://flex.com/resources/25-years-growing-at-flex-in-mexico): Berenice García, Flex HR Generalist, balanced school, work, and family while achieving her goals. A path that reflects growth, learning, and the support of a culture that empowers people to succeed — is a story proudly Made in Flex.
- [Transforming manufacturing through digital Lean operations](https://flex.com/resources/transforming-manufacturing-through-digital-lean-operations): See how combining Lean Six Sigma, automation, AI, and analytics transformed our manufacturing operations.
- [Beyond manufacturing: Integrated services across the product lifecycle](https://flex.com/resources/beyond-manufacturing-integrated-services-across-the-product-lifecycle): Bringing innovative products to market requires more than a manufacturing partner.
- [Understanding the medium-voltage bottleneck in AI expansion](https://flex.com/resources/understanding-the-medium-voltage-bottleneck-in-ai-expansion): In the race to deploy capacity in AI data centers, Medium Voltage (MV) is a major constraint.
- [Solving for scale in a booming market for home-based injectable therapies](https://flex.com/resources/solving-for-scale-in-a-booming-market-for-home-based-injectable-therapies): Learn about delivering insulin, GLP-1 drugs, and other home-based injectable therapies to patients precisely, reliably, and safely.
- [Careers at Flex: From apprentice trainee to Inside Sales in Switzerland](https://flex.com/resources/careers-at-flex-from-apprentice-trainee-to-inside-sales-in-switzerland): Hear how Flex's Inside Sales & Administration Vocational Trainer grew her career starting as an apprentice trainee.
- [Flex and Cerebras Expand Partnership to Scale U.S. Manufacturing](https://flex.com/resources/flex-and-cerebras-expand-partnership-to-scale-u-s-manufacturing): Expansion will support an anticipated 7x increase in production of Cerebras AI Supercomputers.
- [BMR353: High-power, high-efficiency eighth-brick IBC optimized for AI demands](https://flex.com/resources/bmr353-high-power-high-efficiency-eighth-brick-ibc-optimized-for-ai-demands): BMR353 is a next-generation, high-power, non-isolated eighth-brick DC/DC IBC.
- [How a fractured standards landscape threatens data center build timelines](https://flex.com/resources/how-a-fractured-standards-landscape-threatens-data-center-build-timelines): How many standards and certifications would you estimate have influence over the data center sector? It likely isn’t very surprising to know there are more than just one or two, but it might be surprising to find out that there are, quite literally, hundreds relevant to data center infrastructure. The fiscal implications are staggering. Disconnected, redundant, and contradictory safety and technology standards can slow down or even stop forward momentum on data center builds that can take months to address and recover from.
- [Product discontinuation notices](https://flex.com/resources/product-discontinuation-notices)
- [Flex CEO Discusses the Future on The Claman Countdown — Fox Business](https://flex.com/resources/flex-ceo-discusses-the-future-on-the-claman-countdown-fox-business): Revathi Advaithi on the spin-off, sharper focus, and forces transforming power and manufacturing.
- [The scaling problem behind the AI data center boom](https://flex.com/resources/the-scaling-problem-behind-the-ai-data-center-boom): As data center operators race to build out AI infrastructure, they face numerous hurdles. Some are well-documented, including power availability, sustainability pressures, and supply chain disruptions. Others receive less attention but can significantly impact roadmaps, costs, and timelines. Scale and complexity lie behind some of the biggest challenges engineers and operators must solve for today.
- [BMR684: 800 W quarter-brick DC/DC converter for telecom RFPA and datacom applications](https://flex.com/resources/bmr684-800-w-quarter-brick-dc-dc-converter-for-telecom-rfpa-and-datacom-applications): This new variant of the BMR684 is an 800 W quarter-brick isolated DC/DC converter designed for telecom RFPA applications.
- [Modular approach cuts data center build time by 30%](https://flex.com/resources/modular-approach-cuts-data-center-build-time-by-30): Flex modular systems advance scalable data centers by streamlining construction and adapting to compute needs.
- [Addressing power constraints in AI data centers](https://flex.com/resources/addressing-power-constraints-in-ai-data-centers): Flex helps data center operators navigate growing power challenges through integrated, scalable strategies.
- [Flex CEO discusses the new industrial era on Washington Post Live](https://flex.com/resources/flex-ceo-discusses-the-new-industrial-era-on-washington-post-live): CEO Revathi Advaithi joins Washington Post Live on the forces shaping the next era of manufacturing.

## Events
- [COMPAMED](https://flex.com/events/compamed): COMPAMED brings together innovators across the medical technology industry to explore advancements in high-tech solutions, components, and manufacturing. Visit Flex at Hall 8b, Booth E24, and join Manuel Tramontana on November 18 as he discusses the transformation of miniaturized medical devices into intelligent therapeutic systems.
- [Request to Register for Flex Innovation Day](https://flex.com/events/request-to-register-for-flex-innovation-day): This opportunity offers direct access to senior leadership, time to connect with peers across the investment community, and an engaging product showcase highlighting innovative solutions Flex manufactures as well as Axiom’s end-to-end data center infrastructure portfolio. Please email Investor Relations or fill out this form to request to attend.
 
Attendance is limited. We’ll follow up to confirm your registration.
- [Equip Exposition](https://flex.com/events/equip-exposition): Equip Exposition is a leading gathering for the landscape, outdoor living and equipment industries, bringing together contractors, dealers, designers, arborists, manufacturers and other industry professionals. The event combines extensive indoor exhibits with hands-on outdoor demonstrations, showcasing the latest equipment, technologies and solutions shaping the industry.
- [2026 OCP Global Summit](https://flex.com/events/2026-ocp-global-summit): AI is pushing data center infrastructure beyond the assumptions, architectures, and delivery models that defined the cloud era. Meeting the demands of AI at scale requires a more coordinated approach to infrastructure design, construction, and deployment. 
Discover how we’re applying product thinking to the data center to make infrastructure more scalable, efficient, resilient, and predictable.
- [IFA Berlin](https://flex.com/events/ifa-berlin): IFA Berlin is the world's most important event for consumer electronics and home appliances. Meet with our team members to discover how Flex can bring your next innovation to life.
- [CEDIA Expo](https://flex.com/events/cedia-expo): CEDIA Expo delivers industry-driven insights and solutions tailored to the residential systems integration community. Join us in Denver, CO to discuss how Flex can deliver solutions that power today’s homes, workplaces, and connected environments.
- [PDA Universe of Pre-Filled Syringes and Injection Devices Conference](https://flex.com/events/pda-universe-of-pre-filled-syringes-and-injection-devices-conference-2): The PDA Universe of Pre-Filled Syringes and Injection Devices Conference brings together global experts across pharmaceutical development, drug delivery, device development and combination products. The event explores advances in injectable drug delivery, including emerging technologies, manufacturing considerations, patient-centric design and the evolving needs of the drug delivery landscape.
- [SC26](https://flex.com/events/sc26): SC26 brings together the international high-performance computing community to explore advancements across computing, networking, storage and analysis. Researchers, scientists, developers, technology providers and industry leaders come together for a technical program focused on the breakthroughs and emerging technologies shaping the future of advanced computing.
- [Data Centre World Asia](https://flex.com/events/data-centre-world-asia): Data Centre World Asia brings together the entire data centre ecosystem under one roof, featuring five distinct and dynamic theatres - each tailored to spotlight critical facets of the industry. These theatres provide a comprehensive platform for thought leaders, innovators, and decision-makers from across Asia.
- [Google Cloud Next](https://flex.com/events/google-cloud-next): Gain insights into accelerating transformation, optimizing processes, and enhancing customer experiences with advanced AI technologies.
- [UR MiR | Teradyne Robotics webinar](https://flex.com/events/ur-mir-teradyne-robotics-webinar): Join us as we discuss industry needs, constraints and the factory floor realities of using different types of robotics.
- [NVIDIA GTC](https://flex.com/events/nvidia-gtc-2026): Flex was recognized as a key partner in the NVIDIA AI Factory MGX ecosystem at GTC 2026.
- [AIAG North American Catena-X](https://flex.com/events/aiag-north-american-catena-x): Learn about how we're working with Catena-X to advance ecosystem-wide collaboration and data transparency in the mobility industry.
- [Computex Taipei](https://flex.com/events/computex-taipei): Discover how our end-to-end data center portfolio and integrated solutions are changing what's possible in the AI era.
- [Data Center World](https://flex.com/events/data-center-world): Flex and JetCool will be at Data Center World 2026 in Washington DC. Stop by our booth to learn about our data center and liquid cooling solutions.
- [DCD>Connect | New York](https://flex.com/events/dcdconnect-new-york-2026): We were at DCD>Connect New York to discuss how we are overcoming power, heat, and scale challenges in AI data centers.
- [MD&M West](https://flex.com/events/mdm-west): Join us in Anaheim, California on February 3–5 to see the latest from our health solutions business.
- [CES 2026](https://flex.com/events/ces-2026): From January 6-9 in Las Vegas, our automotive business will be showcasing exciting new innovations in two partner booths: compute for SDVs with Infineon at LVCC’s West Hall and power electronics for xEVs with STMicroelectronics at Wynn.
- [PODD Conference](https://flex.com/events/podd-conference-2025): PODD (Partnership Opportunities in Drug Delivery) brings together pharmaceutical, biotechnology, and drug delivery innovators to explore emerging technologies, development strategies, and partnership opportunities. Join Flex in Boston, October 29–30, to connect with our team and discover how we're helping advance next-generation drug delivery solutions. Visit us at Booth 526A.
- [PDA Universe of Pre-Filled Syringes and Injection Devices Conference](https://flex.com/events/pda-universe-of-pre-filled-syringes-and-injection-devices-conference): Flex gave two podium presentations and a tech talk exploring how we’re driving innovation in drug delivery devices.

## Power Module Series
- [ROA170111](https://flex.com/products/power-modules/series/roa170111): The ROA 170 111 evaluation board facilitates evaluation of the 2x40A BMR4690000 module configured either as a single output, or as a dual output device. It is also possible to use the board to evaluate both single output and dual output configured devices simultaneously.
- [ROA170111/1](https://flex.com/products/power-modules/series/roa170111-1): The ROA 170 111/1 evaluation board facilitates evaluation of the 2x25A BMR4696001 module configured either as a single output, or as a dual output device. It is also possible to use the board to evaluate both single output and dual output configured devices simultaneously.
- [ROA17003](https://flex.com/products/power-modules/series/roa17003): The ROA 170 03 evaluation board provides the possibility to evaluate the BMR 461 series of Digital Point of Load devices from 6-18 A.
- [ROA1285068](https://flex.com/products/power-modules/series/roa1285068): The ROA 128 5068 evaluation board provides the possibility to evaluate Single Inline Package (SIP) variants of the BMR 462, 463 and 464 series of Digital Point of Load devices from 12-50A.
- [ROA1285151](https://flex.com/products/power-modules/series/roa1285151): The ROA 128 5151 evaluation board provides the possibility to evaluate the PIM4328 or PIM4820 series of Power Interface Modules.
- [ROA1283836](https://flex.com/products/power-modules/series/roa1283836): The ROA 128 3836 evaluation board provides the possibility to evaluate the BMR 450, 451, 462, 463 and 464 series of Digital Point of Load devices from 12-50A.
- [ROA17044/4B](https://flex.com/products/power-modules/series/roa17044-4b): The ROA17044/2B evaluation board provides the possibility to evaluate the BMR 466 series of Digital Point of Load devices rated at 60A. This version includes 4 x BMR4668012 devices connected in parallel.
- [ROA17044/2B](https://flex.com/products/power-modules/series/roa17044-2b): The ROA17044/2B evaluation board provides the possibility to evaluate the BMR 466 series of Digital Point of Load devices rated at 60A. This version includes 2 x BMR4668004 devices connected in parallel.
- [ROA1283835](https://flex.com/products/power-modules/series/roa1283835): The ROA 128 3835 evaluation board provides the possibility to evaluate the BMR 453, 454, 456, 457 and 458 series of Digital Intermediate Bus Converters (IBC's).
- [ROA17026/3](https://flex.com/products/power-modules/series/roa17026-3): The ROA 170 26 simple evaluation board provides the possibility to evaluate the 18A BMR4614001 series of Digital Point of Load devices.
- [ROA17026](https://flex.com/products/power-modules/series/roa17026): The ROA 170 26 simple evaluation board provides the possibility to evaluate the 12A BMR4613001 series of Digital Point of Load devices.
- [ROA17026/2](https://flex.com/products/power-modules/series/roa17026-2): The ROA 170 26 simple evaluation board provides the possibility to evaluate the 6A BMR4612001 series of Digital Point of Load devices.
- [FAB8020785](https://flex.com/products/power-modules/series/fab8020785): This product serves as an interface adapter or a bridge between a host PC (IBM™ compatible) and one or multiple PMBus design/evaluation boards via a standard type-A to mini-B USB cable.
- [ROA170163/2](https://flex.com/products/power-modules/series/roa170163-2): This board facilitates evaluation of the 4A PMU8218 Point of Load (PoL) module.
- [ROA170163](https://flex.com/products/power-modules/series/roa170163): This board facilitates evaluation of the 6A PMU8318 Point of Load (PoL) module.
- [ROA170163/4](https://flex.com/products/power-modules/series/roa170163-4): This board facilitates evaluation of the 8A PMU8418 Point of Load (PoL) module.
- [ROA170019](https://flex.com/products/power-modules/series/roa170019): The ROA170019 evaluation board provides the possibility to evaluate the BMR480, BMR490, BMR491 or BMR492 series of High Power Intermediate Bus Converters. It can also be used to do basic power testing for the BMR350/351/352 series, although not all digital functions are compatible.
- [ROA170032](https://flex.com/products/power-modules/series/roa170032): The ROA170032 test board provides the possibility to evaluate the BMR480, BMR490, BMR491, BMR350, BMR351 or BMR352 modules in both parallel and stand alone configurations. Up to 3 modules can be paralleled on the board.
- [ROA170228](https://flex.com/products/power-modules/series/roa170228): The ROA170228 test board facilitates evaluation of the PNA2405S3S non-isolated module.
- [ROA1286016](https://flex.com/products/power-modules/series/roa1286016): The ROA1286016 allows evaluation of the BMR4742001 module which is mounted to the board.
- [ROA170050/3](https://flex.com/products/power-modules/series/roa170050-3): The ROA170050 evaluation board provides the possibility to evaluate the 110A BMR482 series of 48V to Load Direct Conversion products.
- [ROA3200x & ROA3230x](https://flex.com/products/power-modules/series/roa3200x-roa3230x): The Test Boards ROA3200x and ROA3230x can be used for testing of the BMR320 & BMR323 8:1 fixed ratio Intermediate Bus Converters (IBC)
- [ROA170268](https://flex.com/products/power-modules/series/roa170268): The Test Board ROA170268 can be used for testing of the BMR684 DC/DC converter for RFPA applications.
- [ROA170347](https://flex.com/products/power-modules/series/roa170347): The Test Board ROA170347 can be used for testing of the BMR511 Integrated Power Stage for VRM applications.
- [ROA1286012](https://flex.com/products/power-modules/series/roa1286012): The Test Board ROA1286012 can be used for testing of the BMR685 DC/DC converter for RFPA applications. It is also suitable for the PKJ4000 series.
- [ROA1285077](https://flex.com/products/power-modules/series/roa1285077): The Test Board ROA1285077 can be used for paralleling of BMR463 or BMR464 digital Point of Load modules.
- [Flex Power Designer (FPD)](https://flex.com/products/power-modules/series/flex-power-designer-fpd): Flex Power Designer is a FREE to use design tool that enables you to easily and intuitively sketch, simulate, configure and monitor your digital power system, enabling definition of relationships across rails, including phase spreading, sequencing, and fault spreading.
- [ROA170314](https://flex.com/products/power-modules/series/roa170314): The Test Board ROA170314 can be used for testing of the BMR510 Integrated Power Stage for VRM applications.
- [ROA1286023](https://flex.com/products/power-modules/series/roa1286023): The ROA1286023 evaluation board provides the possibility to evaluate the BMR473 series of Digital Point of Load devices delivering up to 40 A per module.
- [ROA170286](https://flex.com/products/power-modules/series/roa170286): The ROA170286 evaluation board provides the possibility to evaluate the BMR316 series of unregulated, non-isolated DC/DC converters.
- [ROA170259](https://flex.com/products/power-modules/series/roa170259): The ROA170259 evaluation board provides the possibility to evaluate the BMR314 series of unregulated, non-isolated DC/DC converters.
- [ROA3210](https://flex.com/products/power-modules/series/roa3210): The Test Board ROA3210 can be used for testing of the BMR321 8:1 fixed ratio Intermediate Bus Converter (IBC)
- [BMR353](https://flex.com/products/power-modules/series/bmr353): The BMR353 is a non-isolated digital Intermediate Bus Converter (IBC) with PMBus® interface. The device delivers up to 860 W (72 A) of continuous power at efficiency levels of up to 97.8% (measured at half load) in an industry standard eighth brick measuring 58.4 x 22.7 x 12.8 mm (2.3 x 0.89 x 0.504 in) with a flat baseplate which enables simplified conduction cooling to the customers’ heatsink or cold plate. Peak power delivery of up to 1200 W (100 A) is available for <0.5s.
- [BMR317](https://flex.com/products/power-modules/series/bmr317): The BMR317 is a non‑isolated, unregulated digital Intermediate Bus Converter (IBC) that delivers 800 W continuous power and up to 2 kW peak power in an ultra‑compact footprint measuring just 23.4 × 17.8 × 8.7 mm (L × W × H). With an input range of 40–60 V, its 8:1 conversion ratio provides an output range of 5–7.5 V.
- [RRV](https://flex.com/products/power-modules/series/rrv-series): In partnership with Renesas we have developed the RRV series, which consists of RRV29830 and RRV28830. Both variants share the same footprint 9 x 10 x 5 mm (L x W x H) and deliver a continuous total output current of 40 A per phase or 80 A total, and are capable of delivering a total peak output current of up to 160 A at an output voltage of 0.4-1.8 V. The input voltage range is 3-15 V, which makes them compatible with 4:1 conversion ratio front-end IBCs. Both variants are equipped with Renesas smart power stages.
- [BMR323](https://flex.com/products/power-modules/series/bmr323): The BMR323 is a non-isolated, unregulated Intermediate Bus Converter (IBC) housed in an extremely compact package measuring just 27 x 18 x 6.7 mm (1.06 x 0.71 x 0.26 in), and delivers 600 W of continuous output power and 1,200 W of peak power from an input voltage of 40-60 V. This equates to a power density of up to 368 W/cm3 (6,132 W/in3).
- [BMR352](https://flex.com/products/power-modules/series/bmr352): The BMR352 is a non-isolated digital Intermediate Bus Converter (IBC) with PMBus® interface. The device delivers up to 2000 W of continuous power at efficiency levels of up to 97.9% (measured at half load) in an industry standard quarter brick measuring 58.4 x 36.8 x 14.5 mm (2.3 x 1.45 x 0.58 in) with a flat baseplate which enables simplified conduction cooling to the customers' heatsink or cold plate. Peak power delivery of up to 3000 W (250 A) is available for <0.5s.
- [BMR316](https://flex.com/products/power-modules/series/bmr316): The BMR316 is a non-isolated, unregulated digital IBC (Intermediate Bus Converter) that delivers 1 kW of continuous power, and 2.8 kW of peak power in an ultra-small package measuring just 23.4 x 17.8 x 7.65 mm (LxWxH). Operating over an input voltage range of 38–60 V, the 4:1 input to output ratio results in an output range of 9.5–15 V.
- [BMR321](https://flex.com/products/power-modules/series/bmr321): The BMR321 is a non-isolated, unregulated Intermediate Bus Converter (IBC) housed in a package measuring just 41.47 x 17.67 x 6.9 mm (1.63 x 0.7 x 0.26 in) designed for the OCP OAM v2.0 standard, and delivers 750 W of continuous output power and a peak power of 1,500 W over an input voltage range of 40–60 V.
- [PKJ8200](https://flex.com/products/power-modules/series/pkj8200): The PKJ8200 series is an analog isolated EN50155 compliant DC/DC converter in the industry standard half brick format. They offer a single Vout range between 12-54V. A wide Vin range of 9-75V is offered, making them suitable for 24/36/48V railway applications and a multitude of Industrial applications.
- [BMR511](https://flex.com/products/power-modules/series/bmr511): The BMR511 is a 2-phase intelligent power block which delivers a continuous total output current of 40 A per phase or 80 A total, and is capable of delivering a total peak output current of up to 140 A at an output voltage of 0.5-1.8 V. The input voltage range is 5-15 V, which makes it compatible with 4:1 conversion ratio front-end IBCs. The device delivers an efficiency of 92% at 12 V input / 0.75 V output / 30 A load.
- [BMR351](https://flex.com/products/power-modules/series/bmr351): The BMR351 is a non-isolated digital Intermediate Bus Converter (IBC) with PMBus® interface. The device delivers up to 1,600 W of continuous power at efficiency levels of up to 97.8% (measured at half load) in an industry standard quarter brick measuring 58.4 x 36.8 x 14 mm using an integrated "open deck" baseplate or 14.7 mm using a flat baseplate which enables simplified conduction cooling to the customers' heatsink or cold plate. Peak power delivery of up to 2,320 W (200 A) is available for <0.5s.
- [BMR314](https://flex.com/products/power-modules/series/bmr314): The BMR314 is a non-isolated, unregulated digital IBC (Intermediate Bus Converter) that delivers 800 W of continuous power, and 1.5 kW of peak power in an ultra-small package measuring just 28 x 17.8 x 9.65 mm (LxWxH). Operating over an input voltage range of 38–60 V, the 4:1 input to output ratio results in an output range of 9.5–15 V.
- [BMR684](https://flex.com/products/power-modules/series/bmr684): The BMR684 is a powerful isolated digital DC/DC converter housed in a quarter brick format.
- [BMR320](https://flex.com/products/power-modules/series/bmr320): The BMR320 is a non-isolated, unregulated Intermediate Bus Converter (IBC) housed in an extremely compact package measuring just 27 x 18 x 6.4mm (1.06 x 0.71 x 0.25 in), and delivers 400W of continuous output power from an input voltage of 40-60V. This equates to a power density of 128 W/cm3 (2126 W/in3).
- [BMR473](https://flex.com/products/power-modules/series/bmr473): The BMR473 series is a non-isolated digital DC/DC PoL (Point of Load) regulator that offers exceptional levels of power density for today's most demanding applications. It is available in both a SIP (Single Inline Package) configuration, and a horizontal mount package.
- [BMR520](https://flex.com/products/power-modules/series/bmr520): The BMR5201000 is an isolated Intermediate Bus Converter (IBC) housed in a vertically mounted "power blade" package which minimizes the customer board area needed for the power solution. Each surface mounted power blade delivers up to 300 W at efficiency levels of 94.9% (measured at 53Vin and full load) in a package measuring just 40mm (L) x 17.2mm (W) x 20mm (H), and up to 3 power blades can be connected in parallel to deliver up to 900W of total power in roughly the same board area required by a traditional Quarter Brick package. 1-3 power blades are supported by the external digital controller assembly (BMR5202000/001) measuring just 17 x 17 x 11.6mm, offering PMBus® compatible communications and control features.
- [PUC-BG](https://flex.com/products/power-modules/series/puc-bg): The PUC-BG series is a range of isolated, unregulated 2 W DC/DC converters suitable for the Industrial & Transportation markets, specifically designed for gate drive applications for IGBT, Si and SiC devices.
- [BMR510](https://flex.com/products/power-modules/series/bmr510): The BMR510 is a 2-phase intelligent power block which delivers a continuous total output current of 40 A per phase or 80 A total, and is capable of delivering a total peak output current of up to 160 A at an output voltage of 0.5-1.3 V. The input voltage range is 4.5-15 V, which makes it compatible with 4:1 conversion ratio front-end IBCs. The device delivers an efficiency of more than 90% at 13.5 V input / 0.8 V output / 40 A load.
- [BMR350](https://flex.com/products/power-modules/series/bmr350): The BMR350 is a non-isolated digital Intermediate Bus Converter (IBC) with PMBus® interface. The device delivers up to 1300 W of continuous power at efficiency levels of >97.8% (measured at half load) in an industry standard quarter brick measuring 58.4 x 36.8 x 12 mm, which includes an integrated "open deck" baseplate enabling simplified conduction cooling to the customers' heatsink or cold plate. Peak power delivery of up to 1700 W (140 A) is also possible for short durations (<1s).

## Technical Abbreviations
- [QFP – Quad Flat Package](https://flex.com/technical-abbreviations/qfp-quad-flat-package): A surface-mount integrated-circuit package with leads extending from all four sides of a flat, rectangular body.
- [PD – Pollution Degree](https://flex.com/technical-abbreviations/pd-pollution-degree): Classification of the environmental conditions that determine the level of contamination and insulation requirements for electrical equipment.
- [OVC – Over Voltage Category](https://flex.com/technical-abbreviations/ovc-over-voltage-category): Classification of electrical equipment based on the level of transient overvoltage it may experience.
- [NVRAM – Non-Volatile Random-Access Memory](https://flex.com/technical-abbreviations/nvram-non-volatile-random-access-memory): Random-access memory that retains stored data when power is removed.
- [MTV – Mechanical Test Vehicle](https://flex.com/technical-abbreviations/mtv-mechanical-test-vehicle): Test assembly used to evaluate the mechanical performance and reliability of a product or component.
- [FIFO – First In, First Out](https://flex.com/technical-abbreviations/fifo-first-in-first-out): A data storage and processing method in which the first item written is the first item read.
- [EEPROM – Electrically Erasable Programmable Read-Only Memory](https://flex.com/technical-abbreviations/eeprom-electrically-erasable-programmable-read-only-memory): A nonvolatile memory that can be electrically erased and reprogrammed while retaining stored data when power is removed.
- [CPLD – Complex Programmable Logic Device](https://flex.com/technical-abbreviations/cpld-complex-programmable-logic-device): A programmable digital logic device containing multiple logic blocks and configurable interconnects for implementing custom digital functions.
- [ALU – Arithmetic Logic Unit](https://flex.com/technical-abbreviations/alu-arithmetic-logic-unit): A digital circuit within a processor or controller that performs arithmetic, logical, and bitwise operations on data.
- [PoP – Package on Package](https://flex.com/technical-abbreviations/pop-package-on-package): Semiconductor packaging technology that vertically stacks multiple packages.
- [HRMG – High Resistance Midpoint Grounding](https://flex.com/technical-abbreviations/hrmg-high-resistance-midpoint-grounding): Grounding method connecting the mid-point of a DC system to ground through a high-value resistor.
- [HRG – High Resistance Grounding](https://flex.com/technical-abbreviations/hrg-high-resistance-grounding): Grounding method that limits ground-fault current using a high-value resistor.
- [UEC – Ultra Ethernet Consortium](https://flex.com/technical-abbreviations/uec-ultra-ethernet-consortium): Industry consortium developing Ethernet technologies optimized for AI and high-performance computing.
- [SONiC – Software for Open Networking in the Cloud](https://flex.com/technical-abbreviations/sonic-software-for-open-networking-in-the-cloud): Open-source network operating system designed for scalable, disaggregated data-center networks.
- [SUE – Scale-Up Ethernet](https://flex.com/technical-abbreviations/sue-scale-up-ethernet): High-performance Ethernet technology designed for connectivity between AI processors and accelerators.
- [OISA – Omni-Directional Intelligent Sensing](https://flex.com/technical-abbreviations/oisa-omni-directional-intelligent-sensing): Intelligent sensing approach providing multi-directional detection and data processing.
- [HBD – High Bandwidth Domain](https://flex.com/technical-abbreviations/hbd-high-bandwidth-domain): High-bandwidth architecture supporting rapid data transfer between compute and memory resources.
- [BESS – Battery Energy Storage System](https://flex.com/technical-abbreviations/bess-battery-energy-storage-system): Battery based system for storing electrical energy for backup, load management and grid support.
- [AIDC – Artificial Intelligence Data Center](https://flex.com/technical-abbreviations/aidc-artificial-intelligence-data-center): Data center optimized for high-density AI computing, power delivery and advanced cooling.
- [WCA – Working Capital Agreement](https://flex.com/technical-abbreviations/wca-working-capital-agreement): Agreement defining the terms and arrangements governing the financing or management of working capital between parties.
- [SSCM – Strategic Supply Chain Management](https://flex.com/technical-abbreviations/sscm-strategic-supply-chain-management): Strategic planning and management of supply-chain activities to improve resilience, cost, efficiency, capacity and long-term business performance.
- [SS – Safety Stock](https://flex.com/technical-abbreviations/ss-safety-stock): Additional inventory held to protect against demand fluctuations, supply disruptions or variations in lead
- [LTA – Long-Term Agreement](https://flex.com/technical-abbreviations/lta-long-term-agreement): Contract establishing commercial and supply terms between parties over an extended period, often covering pricing, volumes and delivery commitments.
- [ITO – Inventory Turnover](https://flex.com/technical-abbreviations/ito-inventory-turnover): Measure of how frequently inventory is sold and replaced over a given period, indicating inventory-management efficiency.
- [IDA – Inventory Deposit Agreement](https://flex.com/technical-abbreviations/ida-inventory-deposit-agreement): Agreement under which a customer or supplier provides funding or a deposit to support the purchase or holding of inventory, helping secure supply and manage inventory commitments.
- [FCF – Free Cash Flow](https://flex.com/technical-abbreviations/fcf-free-cash-flow): Cash generated by a business after accounting for operating expenses and capital expenditures, available for investment, debt repayment or other uses.
- [E&O – Excess and Obsolete](https://flex.com/technical-abbreviations/eo-excess-and-obsolete): Inventory that exceeds current requirements or is no longer expected to be used or sold, creating a potential financial write-off.
- [DSO – Days Sales Outstanding](https://flex.com/technical-abbreviations/dso-days-sales-outstanding): Measure of the average number of days a company takes to collect payment after making a sale.
- [EDPP – Extreme Dynamic Power Profile](https://flex.com/technical-abbreviations/edpp-extreme-dynamic-power-profile): Power-consumption behaviour characterized by very large and rapid load changes over short time periods, typical of AI accelerators and high-performance compute workloads.
- [MPA – Master Purchase Agreement](https://flex.com/technical-abbreviations/mpa-master-purchase-agreement): Framework agreement that defines the general commercial, legal and supply terms governing ongoing purchases between a buyer and supplier.
- [GAE – Grid-Aware Efficiency](https://flex.com/technical-abbreviations/gae-grid-aware-efficiency): Metric that considers both energy efficiency and the carbon intensity or availability of grid power, optimizing operation based on when and how energy is sourced.
- [CPE – Compute Power Efficiency](https://flex.com/technical-abbreviations/cpe-compute-power-efficiency): Metric that evaluates how efficiently electrical power is converted into useful compute work, reflecting the performance output per unit of power consumed.
- [ERE – Energy Reuse Effectiveness](https://flex.com/technical-abbreviations/ere-energy-reuse-effectiveness): Metric that measures how effectively a data center reuses waste energy, calculated by accounting for recovered energy relative to total facility energy consumption.
- [SST – Solid State Transformer](https://flex.com/technical-abbreviations/sst-solid-state-transformer): Power-electronic-based transformer that uses high-frequency conversion and control to provide voltage transformation, isolation, and regulation with improved efficiency, reduced size, and advanced grid-control capabilities.
- [SSCB – Solid State Circuit Breaker](https://flex.com/technical-abbreviations/sscb-solid-state-circuit-breaker): Electronic circuit protection device that uses semiconductor switches to interrupt fault currents rapidly, offering faster response, higher reliability, and arc-free operation compared to mechanical breakers.
- [SIMD – Single Instruction, Multiple Data](https://flex.com/technical-abbreviations/simd-single-instruction-multiple-data): Parallel processing model where a single instruction operates on multiple data elements simultaneously, improving performance for vector and data-parallel workloads.
- [ZIF – Zero Insertion Force](https://flex.com/technical-abbreviations/zif-zero-insertion-force): Socket design allowing ICs to be inserted without pressure, minimizing pin damage.
- [ZEV – Zero Emission Vehicle](https://flex.com/technical-abbreviations/zev-zero-emission-vehicle): Vehicle producing no exhaust emissions during operation, such as electric or hydrogen-powered types.
- [ZCS – Zero Current Switching](https://flex.com/technical-abbreviations/zcs-zero-current-switching): Switching technique where current falls to zero before transition, reducing losses and EMI.
- [ZBFW – Zone-Based Firewall](https://flex.com/technical-abbreviations/zbfw-zone-based-firewall): Security model that groups interfaces into zones and applies policies to traffic between zones rather than to individual interfaces.
- [XR – Extended Reality](https://flex.com/technical-abbreviations/xr-extended-reality): Collective term encompassing AR, VR, and MR immersive technologies.
- [xPU – arbitrary Processing Unit](https://flex.com/technical-abbreviations/xpu-arbitrary-processing-unit): Generic term encompassing all types of compute accelerators - CPU, GPU, DPU, TPU, IPU, and others — used collaboratively in modern AI systems.
- [WSE – Wafer-Scale Engine](https://flex.com/technical-abbreviations/wse-wafer-scale-engine): A processor built on a full silicon wafer, offering extremely high compute density and bandwidth for AI workloads.
- [WBG – Wide Band Gap (semiconductor)](https://flex.com/technical-abbreviations/wbg-wide-band-gap-semiconductor): Class of semiconductors (e.g., SiC, GaN) enabling higher efficiency and voltage operation.
- [VMC – Voltage Mode Control](https://flex.com/technical-abbreviations/vmc-voltage-mode-control): Feedback control system where the output voltage directly determines the PWM duty cycle for regulation.
- [VCO – Voltage Controlled Oscillator](https://flex.com/technical-abbreviations/vco-voltage-controlled-oscillator): Oscillator whose frequency is controlled by an input voltage, key in PLLs and RF systems.
- [UL-MIMO – Ultra-Large-Scale MIMO](https://flex.com/technical-abbreviations/ul-mimo-ultra-large-scale-mimo): Next-generation antenna architecture using thousands of elements to achieve extreme spatial resolution and capacity, primarily in 6G and THz research.
- [UKCA – UK Conformity Assessed](https://flex.com/technical-abbreviations/ukca-uk-conformity-assessed): Post-Brexit product marking confirming compliance with UK regulations, equivalent to the EU’s CE marking.
- [UCIe – Universal Chiplet Interconnect Express](https://flex.com/technical-abbreviations/ucie-universal-chiplet-interconnect-express): Industry standard for die-to-die interconnects enabling chiplet-based architectures with common protocols for compute, memory, and I/O integration.
- [TSV – Through-Silicon Via](https://flex.com/technical-abbreviations/tsv-through-silicon-via): Vertical electrical connection passing through a silicon die to enable stacking in 3D ICs and high-bandwidth memory systems.

## Component Meta
- [Product Attributes](https://flex.com/component_meta/product-attributes)
- [Unregulated/Fixed Ratio](https://flex.com/component_meta/unregulated-fixed-ratio)
- [Regulated](https://flex.com/component_meta/regulated)
- [Non-Isolated](https://flex.com/component_meta/non-isolated)
- [Isolated](https://flex.com/component_meta/isolated)
- [Status](https://flex.com/component_meta/status)
- [Isolation](https://flex.com/component_meta/isolation)
- [Regulation](https://flex.com/component_meta/regulation)
- [Digital Interfaces](https://flex.com/component_meta/digital-interfaces)
- [Input Voltage](https://flex.com/component_meta/input-voltage)
- [Output Voltage](https://flex.com/component_meta/output-voltage)
- [Input Voltage (min)](https://flex.com/component_meta/input-voltage-min)
- [Input Voltage (max)](https://flex.com/component_meta/input-voltage-max)
- [Output Voltage (typical)](https://flex.com/component_meta/output-voltage-typical)
- [Output Voltage (min)](https://flex.com/component_meta/output-voltage-min)
- [Output Voltage (max)](https://flex.com/component_meta/output-voltage-max)
- [Output Power](https://flex.com/component_meta/output-power)
- [Output Current](https://flex.com/component_meta/output-current)
- [Product Type](https://flex.com/component_meta/product-type)
- [Product Type](https://flex.com/component_meta/product-type-2)
- [Subtype](https://flex.com/component_meta/subtype)
- [Paralleling](https://flex.com/component_meta/paralleling)
- [Isolation Voltage](https://flex.com/component_meta/isolation-voltage)
- [Size](https://flex.com/component_meta/size)
- [Multi-Output](https://flex.com/component_meta/multi-output)
- [Telecom](https://flex.com/component_meta/telecom)
- [RFPA](https://flex.com/component_meta/rfpa)
- [Data Center and Cloud](https://flex.com/component_meta/data-center-and-cloud)
- [Industrial](https://flex.com/component_meta/industrial)
- [Transportation and railway](https://flex.com/component_meta/transportation-and-railway)
- [Legacy ID](https://flex.com/component_meta/legacy-id)
- [Series Ref](https://flex.com/component_meta/series-ref)
- [Series Image](https://flex.com/component_meta/series-image)
- [Image Override](https://flex.com/component_meta/image-override)
- [Series](https://flex.com/component_meta/component-series)
- [Output Power (Peak)](https://flex.com/component_meta/output-power-peak)
- [Output Current (Peak)](https://flex.com/component_meta/output-current-peak)
- [Typical Efficiency](https://flex.com/component_meta/typical-efficiency)
- [Length](https://flex.com/component_meta/length)
- [Width](https://flex.com/component_meta/width)
- [Height](https://flex.com/component_meta/height)
- [Package Footprint](https://flex.com/component_meta/package-footprint)
- [Package Type](https://flex.com/component_meta/package-type)
- [Mounting Type](https://flex.com/component_meta/mounting-type)
- [Application](https://flex.com/component_meta/application)
- [Base Model Name](https://flex.com/component_meta/base-model-name)
- [Material Name](https://flex.com/component_meta/material-name-2)
- [Release Date](https://flex.com/component_meta/release-date)
- [Application Keywords](https://flex.com/component_meta/application-keywords)
- [Power Module Type](https://flex.com/component_meta/power-module-type)

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